Microstructural Evaluation of Bi-Ag and Bi-Sb Lead-Free High-Temperature Solder Candidates on Copper Substrate with Multiple Reflow Number

An impetus has been provided towards the development of lead-free solders by worldwide environmental legislation that banned the use of lead in solders due to the lead toxicity.This study focus on Bi-Ag and Bi-Sb solder alloys, in compositions from 1.5 to 5 wt % Ag and Sb. The effects of Ag and Sb a...

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Veröffentlicht in:	Applied Mechanics and Materials 2014-06, Vol.564 (Advances in Mechanical and Manufacturing Engineering), p.388-393
Hauptverfasser:	Nahavandi, Mahdi, Mohamed Ariff, Azmah Hanim, Baserfalak, F., Ismarrubie, Z.N.
Format:	Artikel
Sprache:	eng
Schlagworte:	Alloys Antimony Copper INTERMETALLIC COMPOUNDS Lead free Metallurgy Microstructure MICROSTRUCTURES REFLOWING Silver SOLDERING ALLOYS Solders
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