A reference device for evaluating the thermal behavior of installed multilayered wall containing a phase change material

•Thermal analysis of installed wallboards embedding phase change material layer.•Simple devices and real conditions for thermal analysis toward a standardization.•Scanning calorimetric measurements as initial condition for data regression.•Bias correction of calorimetric measurements data by installation factors.•Practical approach to identify a reliable thermal curve for capacitive wallboards. Thermal inertia of lightweight building envelopes can be improved including phase change materials in multilayered wallboards. The thermal modeling of buildings for design purposes needs a robust description of the thermal properties of installed phase change materials. A standard method would improve the thermal characterization of commercial products. The aim of the study is to develop a simple methodology to obtain reliable thermal data for phase change materials integrated in multilayered wallboards. The methodology modifies differential scanning calorimetry measurements on phase change material by installation factors to obtain the apparent specific heat vs. temperature for the wallboard layer embedding phase change material. Simple cubic cells were realized as reference devices to simulate a confined environment. A dynamic model of heat transfer was developed to simulate the thermal behavior of devices. Installation factors were calculated by regression of the monitored temperatures inside and outside the devices operating under real environmental conditions. The apparent specific heat of phase change material, measured by differential scanning calorimetry at different rates, resulted in a spread of curves vs. temperature. Mean curves were used as initial condition for regression. The mean calculation method did not significantly affect the installed resulted curve. A unique curve of apparent specific heat vs. temperature best fit data measured over a wide range of experimental devices and conditions. Good regression performances were observed for solid liquid and biphasic states with different thickness of the phase change material layer. The modification of differential scanning calorimetry measurements through installation factors improved the robustness of description. The proposed methodology could be a starting point for the definition of a reference standard for the characterization and comparison of wallboards embedding phase change materials.