Fabrication of Conductive 3D Gold-Containing Microstructures via Direct Laser Writing

Fabrication of Conductive 3D Gold-Containing Microstructures via Direct Laser Writing

3D conductive microstructures containing gold are fabricated by simultaneous photopolymerization and photoreduction via direct laser writing. The photoresist employed consists of water‐soluble polymers and a gold precursor. The fabricated microstructures show good conductivity and are successfully e...

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Veröffentlicht in:Advanced materials (Weinheim) 2016-05, Vol.28 (18), p.3592-3595
Hauptverfasser: Blasco, Eva, Müller, Jonathan, Müller, Patrick, Trouillet, Vanessa, Schön, Markus, Scherer, Torsten, Barner-Kowollik, Christopher, Wegener, Martin
Format: Artikel
Sprache:eng
Schlagworte:
Direct laser writing
Gold
Joints
Microstructure
microstructures
photoreduction
Photoresists
Polymers
Precursors
Three dimensional
two-photon absorption
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Zusammenfassung:3D conductive microstructures containing gold are fabricated by simultaneous photopolymerization and photoreduction via direct laser writing. The photoresist employed consists of water‐soluble polymers and a gold precursor. The fabricated microstructures show good conductivity and are successfully employed for 3D connections between gold pads.
ISSN:0935-9648
1521-4095
DOI:10.1002/adma.201506126