Formation of three-dimensionally integrated nanocrystalline silicon particles by dip-coating method

Printable technologies using silicon nanoink, in which nanocrystalline silicon (nc-Si) quantum dots are dispersed in solvents, are promising for novel electron and photonic device applications. The dip-coating method is applied for the first time to fabricate three-dimensionally integrated structures of nc-Si quantum dots with a uniform size of 10 nm prepared by the very high frequency plasma decomposition of silane gas. We have clarified the major problem of the dip-coating method, which is the formation of stripe structures. To circumvent this problem, we have proposed two methods: coating onto line-and-space-patterned substrates and utilization of electrophoresis force. We have successfully demonstrated the control of the position and number of layers of nc-Si by using a line-and-space-patterned substrate, however, with a limited shape. We have clarified the conditions of the formation of stripe-free regions by varying applied voltage and nc-Si concentration in the electrophoresis method.