High Temperature Bonding Effect of the Room-Temperature-Curing Phosphate Adhesive for C/C Composites

A heat-resistant phosphate adhesive was developed for joining and repairing of C/C composites. The high-temperature bonding effect for both cured adhesive and 1300°C-calcined adhesive had been evaluated through testing high-temperature shear strength of corresponding joints. The results showed that...

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Veröffentlicht in:Key Engineering Materials 2016-02, Vol.680, p.179-183
Hauptverfasser: Xu, Xi Qing, Tao, Xin, Zhuang, Meng Meng, Liu, Jia Chen, Wang, Ming Chao, Geng, Hai Tao
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Sprache:eng
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Zusammenfassung:A heat-resistant phosphate adhesive was developed for joining and repairing of C/C composites. The high-temperature bonding effect for both cured adhesive and 1300°C-calcined adhesive had been evaluated through testing high-temperature shear strength of corresponding joints. The results showed that the bonding strength of cured adhesive decreased from 7.9 MPa at RT to 0.9 MPa at 1300°C, while that of 1300°C-calcined adhesive could maintain about 4 MPa at temperature range from RT to 700°C and then decreased to 1.7 MPa at 1300°C. Besides, with the increasing thermal cycling times at 1300°C, the high-temperature bonding strength at this temperature could maintain at about 2.3 MPa.
ISSN:1013-9826
1662-9795
1662-9795
DOI:10.4028/www.scientific.net/KEM.680.179