Fabrication and thermoelectrical characterization of three-dimensional nanowire networks

Three‐dimensional (3D) assemblies of nanostructures are gaining more and more attention during the recent years as promising systems to increase the integration density in microelectronic devices. Here we present the fabrication of large areas of 3D nanowire networks (NWNWs) of antimony for thermoelectric applications by electrodeposition in etched ion‐track membranes. The synthesis parameters have been investigated and optimized to achieve mechanically stable and free‐standing NWNWs without a supporting matrix. A cross‐plane method for the complete steady state thermoelectric characterization of an embedded nanowire assembly (NWA) is also introduced, which enables the measurements of Seebeck‐coefficient, cross‐plane thermal conductivity, and electrical resistance of the NWA, and can also be applied to thin films. First results of the thermoelectric properties of Sb NWA are presented.