Fabrication and Assembly of Cu-RDL-Based 2.5-D Low-Cost Through Silicon Interposer (LC-TSI)

Fabrication and Assembly of Cu-RDL-Based 2.5-D Low-Cost Through Silicon Interposer (LC-TSI)

Two-and-a-half-dimensional integration enables high-density interdie connections with low cost. This paper presents a through silicon interposer (TSI) fabrication process and detailed characterization and measurement results of redistribution layers and through silicon vias for low-cost 2.5-D integr...

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Veröffentlicht in:IEEE design and test 2015-08, Vol.32 (4), p.23-31
Hauptverfasser: Katti, Guruprasad, Ho, S. W., Li Hong Yu, Songbai Zhang, Dutta, Rahul, Weerasekera, Roshan, Ka Fai Chang, Jong-Kai Lin, Vempati, Srinivasa Rao, Bhattacharya, Surya
Format: Magazinearticle
Sprache:eng
Schlagworte:
Assembly
CADCAM
Circuit synthesis
Copper
Dielectrics
Fabrication
Integrated circuit manufacture
Interconnections
Low cost Through-Silicon Interposer (TSI)
Microelectronics
polymer based Cu-RDL technology
Polymers
Silicon
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Zusammenfassung:Two-and-a-half-dimensional integration enables high-density interdie connections with low cost. This paper presents a through silicon interposer (TSI) fabrication process and detailed characterization and measurement results of redistribution layers and through silicon vias for low-cost 2.5-D integration.
ISSN:2168-2356
2168-2364
DOI:10.1109/MDAT.2015.2424429