Effect of interface modification by Cu-coated W powders on the microstructure evolution and properties improvement for Cu–W composites

The effects of interfacial bond and homogeneous microstructure on the physical properties of Cu–W composites have been investigated. To acquire strong interfacial bond and homogeneous microstructure, different modified W powders have been designed, which W powders were coated with different Cu conte...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:Surface & coatings technology 2016-02, Vol.288, p.8-14
Hauptverfasser: Chen, Pingan, Shen, Qiang, Luo, Guoqiang, Wang, Chuanbing, Li, Meijuan, Zhang, Lianmeng, Li, Xiangchen, Zhu, Boquan
Format: Artikel
Sprache:eng
Schlagworte:
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The effects of interfacial bond and homogeneous microstructure on the physical properties of Cu–W composites have been investigated. To acquire strong interfacial bond and homogeneous microstructure, different modified W powders have been designed, which W powders were coated with different Cu contents using electroless plating method. The results showed that by increasing the Cu content of the coating, the microstructure of Cu–W composites becomes homogeneous, and the physical properties, including thermal, electrical and mechanical properties, improved greatly. When 20Cu@W composite powders were used to fabricate Cu–W composites, the physical properties reached the optimal values: The thermal conductivity was 239W/(m·K) which was close to the theoretical vaule of 240W/(m·K), the electrical conductivity was 50.6%IACS, coefficient of thermal expansion was the minimum value of 7.3×10−6/K, the bending strength and Vickers hardness were 976.7MPa and 224.8HV, respectively. These optimal values were much higher than those of mixed Cu–W composites. The properties enhancement of Cu–W composites is attributed to the strong interfacial bond between Cu and W and homogeneous microstructure. This enhancement effect was strengthened by increasing the coating's Cu content, resulting in the continuous improvement of the physical properties. •W powders were uniformly coated with highly purified Cu by electroless plating method.•The physical properties improve greatly with increasing Cu content in the coating.•Ideal Cu network structure provides a perfect path for electron transportation.•Strong interfacial bond between Cu and W improves the stress transfer.
ISSN:0257-8972
1879-3347
DOI:10.1016/j.surfcoat.2016.01.014