Substrate heating and cooling during magnetron sputtering of copper target

Heating and cooling processes of the substrate during the DC magnetron sputtering of the copper target were investigated. The sensitive element of a thermocouple was used as a substrate. It was found, that the heat outflow rate from the substrate is lower when the magnetron is turned off rather than...

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Veröffentlicht in:	Physics letters. A 2016-02, Vol.380 (7-8), p.882-885
Hauptverfasser:	Shapovalov, Viktor I., Komlev, Andrey E., Bondarenko, Anastasia S., Baykov, Pavel B., Karzin, Vitaliy V.
Format:	Artikel
Sprache:	eng
Schlagworte:	Cooling Copper Copper film CURRENT DENSITY DC magnetron sputtering DEPOSITION Discharge Heating Magnetron sputtering Outflow Solid state physics SPUTTERING Substrate cooling Substrate heating
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