Substrate heating and cooling during magnetron sputtering of copper target

Heating and cooling processes of the substrate during the DC magnetron sputtering of the copper target were investigated. The sensitive element of a thermocouple was used as a substrate. It was found, that the heat outflow rate from the substrate is lower when the magnetron is turned off rather than when it is turned on. Furthermore, the heating rate, the ultimate temperature, and the heat outflow rate related to the deposition of copper atoms are directly proportional to the discharge current density. •New effect of heat outflow from substrate when magnetron is on was discovered.•This new effect is linear in terms of heat outflow rate to target current ratio.•Kinetic equation for heating process additively considers this effect.