Substrate heating and cooling during magnetron sputtering of copper target
Heating and cooling processes of the substrate during the DC magnetron sputtering of the copper target were investigated. The sensitive element of a thermocouple was used as a substrate. It was found, that the heat outflow rate from the substrate is lower when the magnetron is turned off rather than...
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| Veröffentlicht in: | Physics letters. A 2016-02, Vol.380 (7-8), p.882-885 |
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| container_title | Physics letters. A |
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| creator | Shapovalov, Viktor I. Komlev, Andrey E. Bondarenko, Anastasia S. Baykov, Pavel B. Karzin, Vitaliy V. |
| description | Heating and cooling processes of the substrate during the DC magnetron sputtering of the copper target were investigated. The sensitive element of a thermocouple was used as a substrate. It was found, that the heat outflow rate from the substrate is lower when the magnetron is turned off rather than when it is turned on. Furthermore, the heating rate, the ultimate temperature, and the heat outflow rate related to the deposition of copper atoms are directly proportional to the discharge current density.
•New effect of heat outflow from substrate when magnetron is on was discovered.•This new effect is linear in terms of heat outflow rate to target current ratio.•Kinetic equation for heating process additively considers this effect. |
| doi_str_mv | 10.1016/j.physleta.2015.12.021 |
| format | Article |
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•New effect of heat outflow from substrate when magnetron is on was discovered.•This new effect is linear in terms of heat outflow rate to target current ratio.•Kinetic equation for heating process additively considers this effect.</description><identifier>ISSN: 0375-9601</identifier><identifier>EISSN: 1873-2429</identifier><identifier>DOI: 10.1016/j.physleta.2015.12.021</identifier><language>eng</language><publisher>Elsevier B.V</publisher><subject>Cooling ; Copper ; Copper film ; CURRENT DENSITY ; DC magnetron sputtering ; DEPOSITION ; Discharge ; Heating ; Magnetron sputtering ; Outflow ; Solid state physics ; SPUTTERING ; Substrate cooling ; Substrate heating</subject><ispartof>Physics letters. A, 2016-02, Vol.380 (7-8), p.882-885</ispartof><rights>2015 Elsevier B.V.</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c481t-4119b0d14b8a45ce3b8394daab286ee9bae26ab57f3770f6b69314d90b4464643</citedby><cites>FETCH-LOGICAL-c481t-4119b0d14b8a45ce3b8394daab286ee9bae26ab57f3770f6b69314d90b4464643</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://dx.doi.org/10.1016/j.physleta.2015.12.021$$EHTML$$P50$$Gelsevier$$H</linktohtml><link.rule.ids>314,780,784,3550,27924,27925,45995</link.rule.ids></links><search><creatorcontrib>Shapovalov, Viktor I.</creatorcontrib><creatorcontrib>Komlev, Andrey E.</creatorcontrib><creatorcontrib>Bondarenko, Anastasia S.</creatorcontrib><creatorcontrib>Baykov, Pavel B.</creatorcontrib><creatorcontrib>Karzin, Vitaliy V.</creatorcontrib><title>Substrate heating and cooling during magnetron sputtering of copper target</title><title>Physics letters. A</title><description>Heating and cooling processes of the substrate during the DC magnetron sputtering of the copper target were investigated. The sensitive element of a thermocouple was used as a substrate. It was found, that the heat outflow rate from the substrate is lower when the magnetron is turned off rather than when it is turned on. Furthermore, the heating rate, the ultimate temperature, and the heat outflow rate related to the deposition of copper atoms are directly proportional to the discharge current density.
•New effect of heat outflow from substrate when magnetron is on was discovered.•This new effect is linear in terms of heat outflow rate to target current ratio.•Kinetic equation for heating process additively considers this effect.</description><subject>Cooling</subject><subject>Copper</subject><subject>Copper film</subject><subject>CURRENT DENSITY</subject><subject>DC magnetron sputtering</subject><subject>DEPOSITION</subject><subject>Discharge</subject><subject>Heating</subject><subject>Magnetron sputtering</subject><subject>Outflow</subject><subject>Solid state physics</subject><subject>SPUTTERING</subject><subject>Substrate cooling</subject><subject>Substrate heating</subject><issn>0375-9601</issn><issn>1873-2429</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2016</creationdate><recordtype>article</recordtype><recordid>eNqFkM1LxDAQxYMouK7-C9Kjl9ZMkn7kpix-suBBPYckne526TY1SQX_e1tXzzKHNwzvPZgfIZdAM6BQXO-yYfsVOow6YxTyDFhGGRyRBVQlT5lg8pgsKC_zVBYUTslZCDtKpySVC_L8OpoQvY6YbFHHtt8kuq8T61w37_XoZ9nrTY_Ruz4Jwxgj_hxdM9mGAX0Std9gPCcnje4CXvzqkrzf372tHtP1y8PT6nadWlFBTAWANLQGYSotcovcVFyKWmvDqgJRGo2s0CYvG16WtClMITmIWlIjRDENX5KrQ-_g3ceIIap9Gyx2ne7RjUFBKTkTvKLlZC0OVutdCB4bNfh2r_2XAqpmeGqn_uCpGZ4CpiZ4U_DmEMTpkc8WvQq2xd5i3Xq0UdWu_a_iG46sfKA</recordid><startdate>20160222</startdate><enddate>20160222</enddate><creator>Shapovalov, Viktor I.</creator><creator>Komlev, Andrey E.</creator><creator>Bondarenko, Anastasia S.</creator><creator>Baykov, Pavel B.</creator><creator>Karzin, Vitaliy V.</creator><general>Elsevier B.V</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7QQ</scope><scope>7U5</scope><scope>8FD</scope><scope>H8D</scope><scope>H8G</scope><scope>JG9</scope><scope>L7M</scope></search><sort><creationdate>20160222</creationdate><title>Substrate heating and cooling during magnetron sputtering of copper target</title><author>Shapovalov, Viktor I. ; Komlev, Andrey E. ; Bondarenko, Anastasia S. ; Baykov, Pavel B. ; Karzin, Vitaliy V.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c481t-4119b0d14b8a45ce3b8394daab286ee9bae26ab57f3770f6b69314d90b4464643</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2016</creationdate><topic>Cooling</topic><topic>Copper</topic><topic>Copper film</topic><topic>CURRENT DENSITY</topic><topic>DC magnetron sputtering</topic><topic>DEPOSITION</topic><topic>Discharge</topic><topic>Heating</topic><topic>Magnetron sputtering</topic><topic>Outflow</topic><topic>Solid state physics</topic><topic>SPUTTERING</topic><topic>Substrate cooling</topic><topic>Substrate heating</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Shapovalov, Viktor I.</creatorcontrib><creatorcontrib>Komlev, Andrey E.</creatorcontrib><creatorcontrib>Bondarenko, Anastasia S.</creatorcontrib><creatorcontrib>Baykov, Pavel B.</creatorcontrib><creatorcontrib>Karzin, Vitaliy V.</creatorcontrib><collection>CrossRef</collection><collection>Ceramic Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>Technology Research Database</collection><collection>Aerospace Database</collection><collection>Copper Technical Reference Library</collection><collection>Materials Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Physics letters. A</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Shapovalov, Viktor I.</au><au>Komlev, Andrey E.</au><au>Bondarenko, Anastasia S.</au><au>Baykov, Pavel B.</au><au>Karzin, Vitaliy V.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Substrate heating and cooling during magnetron sputtering of copper target</atitle><jtitle>Physics letters. A</jtitle><date>2016-02-22</date><risdate>2016</risdate><volume>380</volume><issue>7-8</issue><spage>882</spage><epage>885</epage><pages>882-885</pages><issn>0375-9601</issn><eissn>1873-2429</eissn><abstract>Heating and cooling processes of the substrate during the DC magnetron sputtering of the copper target were investigated. The sensitive element of a thermocouple was used as a substrate. It was found, that the heat outflow rate from the substrate is lower when the magnetron is turned off rather than when it is turned on. Furthermore, the heating rate, the ultimate temperature, and the heat outflow rate related to the deposition of copper atoms are directly proportional to the discharge current density.
•New effect of heat outflow from substrate when magnetron is on was discovered.•This new effect is linear in terms of heat outflow rate to target current ratio.•Kinetic equation for heating process additively considers this effect.</abstract><pub>Elsevier B.V</pub><doi>10.1016/j.physleta.2015.12.021</doi><tpages>4</tpages></addata></record> |
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| ispartof | Physics letters. A, 2016-02, Vol.380 (7-8), p.882-885 |
| issn | 0375-9601 1873-2429 |
| language | eng |
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| source | Access via ScienceDirect (Elsevier) |
| subjects | Cooling Copper Copper film CURRENT DENSITY DC magnetron sputtering DEPOSITION Discharge Heating Magnetron sputtering Outflow Solid state physics SPUTTERING Substrate cooling Substrate heating |
| title | Substrate heating and cooling during magnetron sputtering of copper target |
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