High-Performance, Solution-Processed, Embedded Multiscale Metallic Transparent Conductors

High-performance multiscale metallic transparent conductors (TCs) are demonstrated by incorporating Ag nanowire (NW) networks into microscale Ag grid structures. Highly conductive Ag grids are fabricated via direct imprinting of an Ag ion ink using a reservoir-assisted mold. In this mold, a macroscale cavity, called the “reservoir”, is designed to connect to a grid-patterned cavity. The reservoir has a large cavity volume, which reduces unwanted residual layers within the grid spacings by introducing a thinner liquid film. The reservoir undergoes a large volume reduction during mold deformation, which improves ink filling within the grid-patterned cavity through deformation-induced ink injection. The multiscale metallic TCs show a sheet resistance (R s) of