Diamond encapsulated photovoltaics for transdermal power delivery

A safe, compact and robust means of wireless energy transfer across the skin barrier is a key requirement for implantable electronic devices. One possible approach is photovoltaic (PV) energy delivery using optical illumination at near infrared (NIR) wavelengths, to which the skin is highly transpar...

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Veröffentlicht in:Biosensors & bioelectronics 2016-03, Vol.77, p.589-597
Hauptverfasser: Ahnood, A., Fox, K.E., Apollo, N.V., Lohrmann, A., Garrett, D.J., Nayagam, D.A.X., Karle, T., Stacey, A., Abberton, K.M., Morrison, W.A., Blakers, A., Prawer, S.
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Sprache:eng
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Zusammenfassung:A safe, compact and robust means of wireless energy transfer across the skin barrier is a key requirement for implantable electronic devices. One possible approach is photovoltaic (PV) energy delivery using optical illumination at near infrared (NIR) wavelengths, to which the skin is highly transparent. In the work presented here, a subcutaneously implantable silicon PV cell, operated in conjunction with an external NIR laser diode, is developed as a power delivery system. The biocompatibility and long-term biostability of the implantable PV is ensured through the use of an hermetic container, comprising a transparent diamond capsule and platinum wire feedthroughs. A wavelength of 980nm is identified as the optimum operating point based on the PV cell's external quantum efficiency, the skin's transmission spectrum, and the wavelength dependent safe exposure limit of the skin. In bench-top experiments using an external illumination intensity of 0.7W/cm2, a peak output power of 2.7mW is delivered to the implant with an active PV cell dimension of 1.5×1.5×0.06mm3. This corresponds to a volumetric power output density of ∼20mW/mm3, significantly higher than power densities achievable using inductively coupled coil-based approaches used in other medical implant systems. This approach paves the way for further ministration of bionic implants •Photovoltaic power delivery system for bioelectronics implants.•Superior volumetric power output density of ∼20mW/mm3.•Diamond encapsulation and packaging for long term implant stability.
ISSN:0956-5663
1873-4235
DOI:10.1016/j.bios.2015.10.022