A step-by-step experiment of 3C-SiC hetero-epitaxial growth on 4H-SiC by CVD
•A step-by-step experiment to investigate the growth mechanism of SiC hetero-epitaxial is proposed.•It has shown protrusive regular “hill” morphology with much lower density of DPB defect in our experiment, which normally were in high density with shallow groove. Based on the defect morphology, an a...
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Veröffentlicht in: | Applied surface science 2015-12, Vol.357, p.985-993 |
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Sprache: | eng |
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Zusammenfassung: | •A step-by-step experiment to investigate the growth mechanism of SiC hetero-epitaxial is proposed.•It has shown protrusive regular “hill” morphology with much lower density of DPB defect in our experiment, which normally were in high density with shallow groove. Based on the defect morphology, an anisotropy migration rate phenomenon of adatoms has been regarded as forming the morphology of DPB defects and a new “DPB defects assist epitaxy” growth mode has been proposed based on Frank-van der Merwe growth mode.
To investigate the growth mechanism of hetero-epitaxial SiC, a step-by-step experiment of 3C-SiC epitaxial layers grown on 4H-SiC on-axis substrates by the CVD method are reported in this paper. Four step experiments with four one-quarter 4H-SiC wafers were performed. Optical microscopy and atomic force microscopy (AFM) were used to characterize the morphology of the epitaxial layers. It was previously found that the main factor affecting the epilayer morphology was double-positioning boundary (DPB) defects, which normally were in high density with shallow grooves. However, a protrusive regular “hill” morphology with a much lower density was shown in our experiment in high-temperature growth conditions. The anisotropic migration of adatoms is regarded as forming the morphology of DPB defects, and a new “DPB defects assist epitaxy” growth mode has been proposed based on the Frank-van der Merwe growth mode. Raman spectroscopy and X-ray diffraction were used to examine the polytypes and the quality of the epitaxial layers. |
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ISSN: | 0169-4332 1873-5584 |
DOI: | 10.1016/j.apsusc.2015.09.090 |