Significant enhancement in the thermal stability of nanocrystalline metals via immiscible tri-phases

Significant enhancement in the thermal stability of nanocrystalline metals via immiscible tri-phases

The thermal stability of sputtered Co–Cu–Ag tri-phase immiscible nanocomposites (TPINs) was compared to nanocrystalline Cu50Ag50 and monolithic Cu. After annealing at 973K, the grain size of Co34Cu33Ag33 was ∼115nm, whereas that of Cu50Ag50 increased to over 700nm. The hardness of annealed Co34Cu33A...

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Veröffentlicht in:Scripta materialia 2012-07, Vol.67 (2), p.177-180
Hauptverfasser: Chen, Y., Liu, Y., Khatkhatay, F., Sun, C., Wang, H., Zhang, X.
Format: Artikel
Sprache:eng
Schlagworte:
Annealing
Cobalt
Forming
Grain size
Hardness
Nanocomposites
Nanocrystalline metals
Nanocrystals
Thermal stability
Tri-phase immiscible nanocomposites
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Zusammenfassung:The thermal stability of sputtered Co–Cu–Ag tri-phase immiscible nanocomposites (TPINs) was compared to nanocrystalline Cu50Ag50 and monolithic Cu. After annealing at 973K, the grain size of Co34Cu33Ag33 was ∼115nm, whereas that of Cu50Ag50 increased to over 700nm. The hardness of annealed Co34Cu33Ag33 TPIN remained high, ∼3GPa, comparing to only 1.0GPa for Cu50Ag50 film. The remarkable thermal stability of the TPIN is largely achieved via the introduction of a third immiscible phase, forming abundant tri-phase triple junctions.
ISSN:1359-6462
1872-8456
DOI:10.1016/j.scriptamat.2012.04.010