Recovery of polyalkylene glycol from silicon cutting waste using centrifugation

A great amount of slurry waste is formed during the cutting process from silicon ingot to wafers. More than 50% of this waste comes from cutting liquids. This study investigated centrifugation to recover polyalkylene glycol (PAG) cutting liquid with low turbidity (

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:Desalination and water treatment 2015-10, Vol.56 (2), p.443-451
Hauptverfasser: Tsai, Tzu-Hsuan, Shih, Yu-Pei
Format: Artikel
Sprache:eng
Schlagworte:
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A great amount of slurry waste is formed during the cutting process from silicon ingot to wafers. More than 50% of this waste comes from cutting liquids. This study investigated centrifugation to recover polyalkylene glycol (PAG) cutting liquid with low turbidity (
ISSN:1944-3986
1944-3994
1944-3986
DOI:10.1080/19443994.2014.936518