Recovery of polyalkylene glycol from silicon cutting waste using centrifugation
A great amount of slurry waste is formed during the cutting process from silicon ingot to wafers. More than 50% of this waste comes from cutting liquids. This study investigated centrifugation to recover polyalkylene glycol (PAG) cutting liquid with low turbidity (
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Veröffentlicht in: | Desalination and water treatment 2015-10, Vol.56 (2), p.443-451 |
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Hauptverfasser: | , |
Format: | Artikel |
Sprache: | eng |
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Online-Zugang: | Volltext |
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Zusammenfassung: | A great amount of slurry waste is formed during the cutting process from silicon ingot to wafers. More than 50% of this waste comes from cutting liquids. This study investigated centrifugation to recover polyalkylene glycol (PAG) cutting liquid with low turbidity ( |
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ISSN: | 1944-3986 1944-3994 1944-3986 |
DOI: | 10.1080/19443994.2014.936518 |