Modification of Sn–1.0Ag–0.5Cu solder using nickel and boron

Modification of Sn–1.0Ag–0.5Cu solder using nickel and boron

Effects of Ni and B additions on the microstructure and growth behavior of the intermetallic compound(IMC) of Sn–1.0Ag–0.5Cu alloys(SAC105) were investigated in this study. Results show that microadditions of Ni and B result in volume fraction of primary Sn increasing and the grain size decreasing o...

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Veröffentlicht in:Rare metals 2015-11, Vol.34 (11), p.783-788
Hauptverfasser: Qu, Jun-Feng, Xu, Jun, Hu, Qiang, Zhang, Fu-Wen, Zhang, Shao-Ming
Format: Artikel
Sprache:eng
Schlagworte:
Alloys
Biomaterials
Chemistry and Materials Science
Energy
Grain size
Lead-free
Materials Engineering
Materials Science
Metallic Materials
Microstructure
Nanoscale Science and Technology
Nickel
Physical Chemistry
reacti
Reinforcement
Shear tests
solder
Sn–1.0Ag–0.5Cu
Interfacial
Solders
Tin
Tin base alloys
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Zusammenfassung:Effects of Ni and B additions on the microstructure and growth behavior of the intermetallic compound(IMC) of Sn–1.0Ag–0.5Cu alloys(SAC105) were investigated in this study. Results show that microadditions of Ni and B result in volume fraction of primary Sn increasing and the grain size decreasing observably. It is found that a large number of fine reinforcement particles with network-like shape are found in the solder, and the thickness of interfacial IMC layer in the solder joint is grew less than that of SAC105 with longer aging time. Shear test results reveal that as-soldered solder joints of microalloyed SAC105 have better shear strength than that of SAC105 solder alloy.
ISSN:1001-0521
1867-7185
DOI:10.1007/s12598-014-0221-7