Residual stress induced wetting variation on electric brush-plated Cu film
Nanocrystalline Cu film with a mirror surface finishing is prepared by the electric brush-plating technique. The as- prepared Cu film exhibits a superhydrophilic behavior with an apparent water contact angle smaller than 10°. A subsequent increase in the water contact angle and a final wetting trans...
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Veröffentlicht in: | Chinese physics B 2014-03, Vol.23 (3), p.572-576 |
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Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | Nanocrystalline Cu film with a mirror surface finishing is prepared by the electric brush-plating technique. The as- prepared Cu film exhibits a superhydrophilic behavior with an apparent water contact angle smaller than 10°. A subsequent increase in the water contact angle and a final wetting transition from inherent hydrophilicity with water contact angle smaller than 90° to apparent hydrophobicity with water contact angle larger than 90° are observed when the Cu film is subjected to natural aging. Analysis based on the measurement of hardness with nanoindentation and the theory of the bond-order-length-strength correlation reveals that this wetting variation on the Cu film is attributed to the relaxation of residual stress generated during brush-plating deposition and a surface hydrophobization role associated with the broken bond polarization induced by surface nanostructure. |
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ISSN: | 1674-1056 2058-3834 1741-4199 |
DOI: | 10.1088/1674-1056/23/3/038201 |