Layered boron nitride as a release layer for mechanical transfer of GaN-based devices

Introducing an extremely thin layer of boron nitride between a sapphire substrate and the gallium nitride semiconductor grown on it is shown to facilitate the transfer of the resulting nitride structures to more flexible and affordable substrates. Lift-off for nitride semiconductors Nitride semiconductors are renowned for their excellent electronic and optical properties and are the materials of choice for many optical devices, including BluRay players. But they have an important practical drawback: they are very particular about the substrates (typically sapphire) on which they can be grown. This has stimulated the search for new ways of transferring such materials from one substrate to another. Here Kobayashi et al . demonstrate, using a gallium nitride-based device, that the addition of an extremely thin layer of hexagonal boron nitride to the initial growth surface facilitates the straightforward mechanical release of the resulting nitride structures, as well as subsequent transfer to any suitable substrate, including metals, glass and transparent plastics. Nitride semiconductors are the materials of choice for a variety of device applications, notably optoelectronics 1 , 2 and high-frequency/high-power electronics 3 . One important practical goal is to realize such devices on large, flexible and affordable substrates, on which direct growth of nitride semiconductors of sufficient quality is problematic. Several techniques—such as laser lift-off 4 , 5 —have been investigated to enable the transfer of nitride devices from one substrate to another, but existing methods still have some important disadvantages. Here we demonstrate that hexagonal boron nitride (h-BN) can form a release layer that enables the mechanical transfer of gallium nitride (GaN)-based device structures onto foreign substrates. The h-BN layer serves two purposes: it acts as a buffer layer for the growth of high-quality GaN-based semiconductors, and provides a shear plane that makes it straightforward to release the resulting devices. We illustrate the potential versatility of this approach by using h-BN-buffered sapphire substrates to grow an AlGaN/GaN heterostructure with electron mobility of 1,100 cm 2 V −1 s −1 , an InGaN/GaN multiple-quantum-well structure, and a multiple-quantum-well light-emitting diode. These device structures, ranging in area from five millimetres square to two centimetres square, are then mechanically released from the sapphire substrates and successfully t