Paper No S12.2: High-Mobility Indium Oxide Thin-Film Transistors by Means of Plasma-Enhanced Atomic Layer Deposition

Indium oxide film has been deposited by plasma‐enhanced atomic layer deposition and adopted as channel materials for high‐mobility thin‐film transistors. The resultant device fabricated at temperature of 200° C showed a field‐effect mobility of as high as 31 cm2/V s in linear region.

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Veröffentlicht in:SID International Symposium Digest of technical papers 2015-09, Vol.46 (S1), p.52-52
Hauptverfasser: Yeom, H. I., Ko, J. B., Hwang, C.-S., Cho, S., Park, S.-H. K.
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container_end_page 52
container_issue S1
container_start_page 52
container_title SID International Symposium Digest of technical papers
container_volume 46
creator Yeom, H. I.
Ko, J. B.
Hwang, C.-S.
Cho, S.
Park, S.-H. K.
description Indium oxide film has been deposited by plasma‐enhanced atomic layer deposition and adopted as channel materials for high‐mobility thin‐film transistors. The resultant device fabricated at temperature of 200° C showed a field‐effect mobility of as high as 31 cm2/V s in linear region.
doi_str_mv 10.1002/sdtp.10529
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subjects Channels
Deposition
Devices
Indium oxides
Resultants
Semiconductor devices
Technical papers
Thin films
Transistors
title Paper No S12.2: High-Mobility Indium Oxide Thin-Film Transistors by Means of Plasma-Enhanced Atomic Layer Deposition
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