Thermal transport across high-pressure semiconductor-metal transition in Si and Si sub(0.991) Ge sub(0.009)

Time-domain thermoreflectance (TDTR) can be applied to metallic samples at high pressures in the diamond anvil cell and provide noncontact measurements of thermal transport properties. We have performed regular and beam-offset TDTR to establish the thermal conductivities of Si and Si sub(0.991) Ge s...

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Veröffentlicht in:Physical review. B, Condensed matter and materials physics Condensed matter and materials physics, 2015-05, Vol.91 (20)
Hauptverfasser: Hohensee, Gregory T, Fellinger, Michael R, Trinkle, Dallas R, Cahill, David G
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Sprache:eng
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Zusammenfassung:Time-domain thermoreflectance (TDTR) can be applied to metallic samples at high pressures in the diamond anvil cell and provide noncontact measurements of thermal transport properties. We have performed regular and beam-offset TDTR to establish the thermal conductivities of Si and Si sub(0.991) Ge sub(0.009) across the semiconductor-metal phase transition and up to 45 GPa. The thermal conductivities of metallic Si and Si(Ge) are comparable to aluminum and indicative of predominantly electronic heat carriers. Metallic Si and Si(Ge) have an anisotropy of approximately 1.4, similar to that of beryllium, due to the primitive hexagonal crystal structure. We used the Wiedemann-Franz law to derive the associated electrical resistivity, and found it consistent with the Bloch-Gruneisen model.
ISSN:1098-0121
1550-235X