Failure Mechanisms of a Gold Microelectrode in Bioelectronics Applications

The generation, growth, and collapse of tiny bubbles are inevitable for a microelectrode working in aqueous environment, thus resulting in physical damages on the microelectrode. The failure mechanisms of a microelectrode induced by tiny bubble collapsing are investigated by generating tiny hydrogen bubbles on a gold microelectrode through deionized water electrolysis. The surface of the microelectrode is modified with a thiol-functionalized arginine-glycine-aspartic acid peptide to generate perfectly spherical bubbles in proximity of the surface. The failure of an Au microelectrode is governed by two damage mechanisms, depending on the thickness of the microelectrode: a water-hammer pressure due to the violent collapse of a single large bubble, formed through merging of small bubbles, for ultrathin Au microelectrodes of 40–60 nm in thickness, and an energy accumulation resulting from the repetitive collapse of tiny bubbles for thick Au microelectrodes of 100–120 nm.