The Effect of Silicon Nitride Addition on Microstructure and Microhardness of SN100C Solder Alloy Using Powder Metallurgy

The effect of Si3N4 particulate addition on the commercial SN100C solder alloy has been investigated. The SN100C/Si3N4composite solder was fabricated via powder metallurgy (PM) technique. In this study five different Si3N4 composition which have been chosen were (0 wt. %, 0.25 wt. %, 0.5 wt. %, 0.75...

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Veröffentlicht in:	Materials science forum 2014-08, Vol.803, p.228-232
Hauptverfasser:	Ramli, Mohd Izrul Izwan, Nazree Derman, Mohd, Mohd Salleh, Mohd Arif Anuar, Nasir, Norhayanti, Mohd Said, Rita, Saud, Norainiza
Format:	Artikel
Sprache:	eng
Schlagworte:	Alloy powders Alloying additive Particulate composites Powder metallurgy Precipitates Precipitation Silicon nitride Solders
Online-Zugang:	Volltext
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