The Effect of Silicon Nitride Addition on Microstructure and Microhardness of SN100C Solder Alloy Using Powder Metallurgy

The Effect of Silicon Nitride Addition on Microstructure and Microhardness of SN100C Solder Alloy Using Powder Metallurgy

The effect of Si3N4 particulate addition on the commercial SN100C solder alloy has been investigated. The SN100C/Si3N4composite solder was fabricated via powder metallurgy (PM) technique. In this study five different Si3N4 composition which have been chosen were (0 wt. %, 0.25 wt. %, 0.5 wt. %, 0.75...

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Veröffentlicht in:Materials science forum 2014-08, Vol.803, p.228-232
Hauptverfasser: Ramli, Mohd Izrul Izwan, Nazree Derman, Mohd, Mohd Salleh, Mohd Arif Anuar, Nasir, Norhayanti, Mohd Said, Rita, Saud, Norainiza
Format: Artikel
Sprache:eng
Schlagworte:
Alloy powders
Alloying additive
Particulate composites
Powder metallurgy
Precipitates
Precipitation
Silicon nitride
Solders
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Zusammenfassung:The effect of Si3N4 particulate addition on the commercial SN100C solder alloy has been investigated. The SN100C/Si3N4composite solder was fabricated via powder metallurgy (PM) technique. In this study five different Si3N4 composition which have been chosen were (0 wt. %, 0.25 wt. %, 0.5 wt. %, 0.75 wt. %, and 1.0 wt. %).The results showed that Si3N4 particulate has remain as foreign particles and precipitate at the grain boundaries thus improved the physical properties of the composite solder compared to monolithic solder alloy. The addition of 1.0 wt. % Si3N4 give highest hardness value to the composite solder.
ISSN:0255-5476
1662-9752
1662-9752
DOI:10.4028/www.scientific.net/MSF.803.228