The Effect of Silicon Nitride Addition on Microstructure and Microhardness of SN100C Solder Alloy Using Powder Metallurgy
The effect of Si3N4 particulate addition on the commercial SN100C solder alloy has been investigated. The SN100C/Si3N4composite solder was fabricated via powder metallurgy (PM) technique. In this study five different Si3N4 composition which have been chosen were (0 wt. %, 0.25 wt. %, 0.5 wt. %, 0.75...
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| Veröffentlicht in: | Materials science forum 2014-08, Vol.803, p.228-232 |
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| creator | Ramli, Mohd Izrul Izwan Nazree Derman, Mohd Mohd Salleh, Mohd Arif Anuar Nasir, Norhayanti Mohd Said, Rita Saud, Norainiza |
| description | The effect of Si3N4 particulate addition on the commercial SN100C solder alloy has been investigated. The SN100C/Si3N4composite solder was fabricated via powder metallurgy (PM) technique. In this study five different Si3N4 composition which have been chosen were (0 wt. %, 0.25 wt. %, 0.5 wt. %, 0.75 wt. %, and 1.0 wt. %).The results showed that Si3N4 particulate has remain as foreign particles and precipitate at the grain boundaries thus improved the physical properties of the composite solder compared to monolithic solder alloy. The addition of 1.0 wt. % Si3N4 give highest hardness value to the composite solder. |
| doi_str_mv | 10.4028/www.scientific.net/MSF.803.228 |
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The SN100C/Si3N4composite solder was fabricated via powder metallurgy (PM) technique. In this study five different Si3N4 composition which have been chosen were (0 wt. %, 0.25 wt. %, 0.5 wt. %, 0.75 wt. %, and 1.0 wt. %).The results showed that Si3N4 particulate has remain as foreign particles and precipitate at the grain boundaries thus improved the physical properties of the composite solder compared to monolithic solder alloy. 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The SN100C/Si3N4composite solder was fabricated via powder metallurgy (PM) technique. In this study five different Si3N4 composition which have been chosen were (0 wt. %, 0.25 wt. %, 0.5 wt. %, 0.75 wt. %, and 1.0 wt. %).The results showed that Si3N4 particulate has remain as foreign particles and precipitate at the grain boundaries thus improved the physical properties of the composite solder compared to monolithic solder alloy. The addition of 1.0 wt. % Si3N4 give highest hardness value to the composite solder.</abstract><pub>Trans Tech Publications Ltd</pub><doi>10.4028/www.scientific.net/MSF.803.228</doi><tpages>5</tpages></addata></record> |
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| subjects | Alloy powders Alloying additive Particulate composites Powder metallurgy Precipitates Precipitation Silicon nitride Solders |
| title | The Effect of Silicon Nitride Addition on Microstructure and Microhardness of SN100C Solder Alloy Using Powder Metallurgy |
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