Device stress evaluation of InAs/AlSb HEMT on silicon substrate with refractory iridium Schottky gate metal

[Display omitted] •The Ir-gate AlSb/InAs HEMT on Si substrate has been studied with reliability evaluation.•The Ir-gate exhibited a superior metal work function.•The Schottky barrier height of InAs/AlSb on silicon was improved.•TEM, SIMS, and low frequency noise measurement were adopted to proof dev...

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Veröffentlicht in:Microelectronic engineering 2015-04, Vol.138, p.17-20
Hauptverfasser: Chiu, Hsien-Chin, Lin, Wen-Yu, Chou, Chia-Yi, Yang, Shih-Hsien, Mai, Kai-Di, Chiu, Pei-chin, Hsueh, W.J., Chyi, Jen-Inn
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Sprache:eng
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Zusammenfassung:[Display omitted] •The Ir-gate AlSb/InAs HEMT on Si substrate has been studied with reliability evaluation.•The Ir-gate exhibited a superior metal work function.•The Schottky barrier height of InAs/AlSb on silicon was improved.•TEM, SIMS, and low frequency noise measurement were adopted to proof device stability. In this work, the 6-inch AlSb/InAs on Si (001) substrate is used to increase device integration and cost-effective purpose. The iridium (Ir)-gate was used for the InAs/AlSb on silicon substrate and temperature-dependent characteristics were also studied. The Ir-gate exhibited a superior metal work function which was beneficial for increasing the Schottky barrier height of InAs/AlSb on silicon heterostructures. Moreover, transmission electron microscopy, secondary ion mass spectrometry, and low frequency noise measurements were conducted to proof that the Ir-gated AlSb/InAs HEMT achieved the better stability of characteristics after self-heating and hot-carrier stresses.
ISSN:0167-9317
1873-5568
DOI:10.1016/j.mee.2015.01.017