Mechanism of Formation of Copper(II) Chloro Complexes Revealed by Transient Absorption Spectroscopy and DFT/TDDFT Calculations

Copper­(II) complexes are extremely labile with typical ligand exchange rate constants on the order of 106–109 M–1 s–1. As a result, it is often difficult to identify the actual formation mechanism of these complexes. In this work, using UV–vis transient absorption when probing in a broad time range...

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Veröffentlicht in:The journal of physical chemistry. B 2015-07, Vol.119 (28), p.8754-8763
Hauptverfasser: Mereshchenko, Andrey S, Olshin, Pavel K, Karabaeva, Kanykey E, Panov, Maxim S, Wilson, R. Marshall, Kochemirovsky, Vladimir A, Skripkin, Mikhail Yu, Tveryanovich, Yury S, Tarnovsky, Alexander N
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Zusammenfassung:Copper­(II) complexes are extremely labile with typical ligand exchange rate constants on the order of 106–109 M–1 s–1. As a result, it is often difficult to identify the actual formation mechanism of these complexes. In this work, using UV–vis transient absorption when probing in a broad time range (20 ps to 8 μs) in conjunction with DFT/TDDFT calculations, we studied the dynamics and underlying reaction mechanisms of the formation of extremely labile copper­(II) CuCl4 2– chloro complexes from copper­(II) CuCl3 – trichloro complexes and chloride ions. These two species, produced via photochemical dissociation of CuCl4 2– upon 420 nm excitation into the ligand-to-metal-charge-transfer electronic state, are found to recombine into parent complexes with bimolecular rate constants of (9.0 ± 0.1) × 107 and (5.3 ± 0.4) × 108 M–1 s–1 in acetonitrile and dichloromethane, respectively. In dichloromethane, recombination occurs via a simple one-step addition. In acetonitrile, where [CuCl3]− reacts with the solvent to form a [CuCl3CH3CN]− complex in less than 20 ps, recombination takes place via ligand exchange described by the associative interchange mechanism that involves a [CuCl4CH3CN]2– intermediate. In both solvents, the recombination reaction is potential energy controlled.
ISSN:1520-6106
1520-5207
DOI:10.1021/acs.jpcb.5b03889