Dynamic Simulations of Hot Iso-static Pressing Diffusion Bonding between K418B and FGH91

Element mutual diffusions between K418B and FGH91 during hot iso-static pressing (HIP) diffusion bonding are simulated by DICTRA and Thermo-Calc software. The inter-diffusion behaviors of the elements of two alloys after HIP are calculated. The distribution of phases formed under different temperatures in the alloys is thermodynamically simulated, which provide a sound theoretical evidence for the determination of composition and the selection of temperature. The joining processing of the two alloys with various temperatures and time is determined by dynamic simulation. By analyzing the changing of elements inter-diffusion distance with the changing of temperatures and time, and taking the huge cost of high temperature and long time into consideration, the proper diffusion time for HIP diffusion bonding is 3 to 5 hours and the proper diffusion temperature is 1120-1150 degree C. copyright 2013 Journal of Mechanical Engineering.