Multifractal analysis for Cu/Ti bilayer thin films

Two bilayer thin films with different stacking sequences, Cu/Ti/Si and Ti/Cu/Si, were deposited by DC magnetron sputtering technique. X‐ray diffraction technique was used to measure the crystallization structures, and scanning electron microscopy and atomic force microscopy were used to measured surface morphology. The multifractal spectra f(α)‐α was used to characterize the surface morphology. The result of |q|max ≤ 53 is obtained by multifractal analysis. The shape of the multifractal spectra f(α) − α is hook‐like for Cu/Ti/Si and bell jar‐like for Ti/Cu/Si. The spectrum width Δα = αmax − αmin and Δf(=f(αmin) − f(αmax)) of the multifractal spectra is able to quantitatively analyze the growth and surface roughness of the Cu/Ti bilayer thin films. The surface of Ti/Cu/Si thin film is more uniform and smoother than the film of Cu/Ti/Si. Copyright © 2013 John Wiley & Sons, Ltd.