Study of the mechanism of ductile-regime grinding of SiCp/Al composites using finite element simulation

Based on indentation experiments under different loads, the mechanism of ductile-regime grinding of SiCp/Al composites has been investigated. The factors that influence the ductile-regime removal of SiC particles, such as tip radius of abrasive grains, intrusion depth, and volume fraction of SiC par...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:International journal of materials research 2012-10, Vol.103 (10), p.1210-1217
Hauptverfasser: Huang, Shutao, Zhou, Li, Yu, Xiaolin, Xu, Lifu
Format: Artikel
Sprache:eng
Schlagworte:
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:Based on indentation experiments under different loads, the mechanism of ductile-regime grinding of SiCp/Al composites has been investigated. The factors that influence the ductile-regime removal of SiC particles, such as tip radius of abrasive grains, intrusion depth, and volume fraction of SiC particles, have been analyzed by three-dimensional finite element simulation. The calculation results indicate that a sharp abrasive grain without tip radius cannot produce a plastic deformation region under the indenter and brittle fracture of the SiC particle takes place rather than ductile model of failure. The critical grinding depth of ductile-regime removal decreases with increasing tip radius of abrasive grains, but increases with decreasing SiC particle volume fraction.
ISSN:1862-5282
2195-8556
DOI:10.3139/146.110754