Sintering of Copper Sub-Micron Particles by Heat and Atmospheric Pressure Non-Equilibrium Plasma Treatments

In this study, a 35-μm-thick copper sub-micron paste (particle diameter of 700 - 900 nm) was printed on an alumina substrate, and then sintered by conventional heating treatment and by atmospheric pressure plasma (APP) treatment, respectively. Surface micro-structures of the printed films sintered by both methods were observed by SEM. As a result, copper sub-micron particles were successfully sintered at a relatively low temperature by APP treatment. Through the SEM micrographs we suppose that the sintering processes by both methods are quite different.