Materials for Electronics by Thermal Spraying

In this paper, dielectric and conductive properties of thermally sprayed Al2O3- and Cu-based coatings on steel and alumina substrates were studied. Alumina powders with nanoand micro-sized additions of Ni, NiO, TiO2, silica, and commercial glass were used in High Velocity Oxygen Fuel (HVOF) depositi...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:Materials science forum 2013-07, Vol.762, p.451-456
Hauptverfasser: Kanerva, Ulla, Peräntie, Jani, Juuti, Jari, Jantunen, Heli, Varis, Tommi, Putaala, Jussi, Ronkainen, Helena, Ruusuvuori, Kimmo, Turunen, Erja
Format: Artikel
Sprache:eng
Schlagworte:
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:In this paper, dielectric and conductive properties of thermally sprayed Al2O3- and Cu-based coatings on steel and alumina substrates were studied. Alumina powders with nanoand micro-sized additions of Ni, NiO, TiO2, silica, and commercial glass were used in High Velocity Oxygen Fuel (HVOF) deposition. The conventional commercial copper powder and three Ag, WC and H2 -modified powders were used in Direct Write Thermal Spray (DWTS) deposition. Mixed phases of α-Al2O3 and γ-Al2O3 were found to be present in the as-deposited coatings. Sprayed alumina-based composites exhibited dielectric permittivity of 5.3-13.9 and losses of 0.002-0.178 at 1 MHz and 1 GHz while the additions tend to increase the values. Sprayed compositions with glass-type additions were found to retain α-Al2O3 crystalline phase after the deposition. Cu depositions, especially modified ones, realised by Direct Write Thermal Spray (DWTS) showed conductivity values as high as 4256 % of IACS values. The results demonstrate that ceramic and conductive coatings fabricated by thermal spray techniques show feasible properties for electrical applications, such as low-frequency components and insulation layers to be utilised in embedded 3D circuitry, in a way that is not possible through traditional manufacturing methods.
ISSN:0255-5476
1662-9752
1662-9752
DOI:10.4028/www.scientific.net/MSF.762.451