Finite Element Analysis of Failure in Cu Interconnect Megasonic Cleaning

Megasonic cleaning has been one of the most successful techniques for Cu/low-k interconnects post-CMP cleaning. The structural deformation and stress of Cu and low-k materials in megasonic cleaning are examined with finite element method (FEM). The maximum stress is concentrated in the binding area...

Ausführliche Beschreibung

Bibliographische Detailangaben

Veröffentlicht in:	Key engineering materials 2013-07, Vol.562-565, p.1471-1476
Hauptverfasser:	Wu, Nian Peng, Meng, Chun Ling, Huang, Ya Ting, Dong, Xiu Ping, Lu, Xin Chun
Format:	Artikel
Sprache:	eng
Schlagworte:	CLEANING CONNECTORS (ELECTRICAL) Copper DEFORMATION FAILURE Finite element method Interconnections MATHEMATICAL ANALYSIS STRESS Stresses YIELD STRENGTH
Online-Zugang:	Volltext
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!