Two improvements in formulation of nine-node element MITC9

SUMMARY The paper concerns a well‐known two‐dimensional nine‐node quadrilateral element MITC9, which is based on two‐level approximations of strains (assumed strain method). The element has good accuracy, but does not pass the patch test. As the first improvement, we propose a modification of the el...

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Veröffentlicht in:International journal for numerical methods in engineering 2013-02, Vol.93 (6), p.612-634
Hauptverfasser: Wisniewski, K., Panasz, P.
Format: Artikel
Sprache:eng
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Zusammenfassung:SUMMARY The paper concerns a well‐known two‐dimensional nine‐node quadrilateral element MITC9, which is based on two‐level approximations of strains (assumed strain method). The element has good accuracy, but does not pass the patch test. As the first improvement, we propose a modification of the element's transformations, partly resolving the problem with the patch test. The source of the problem is the use of covariant components in a (local) natural co‐basis, different at each sampling point. As the second improvement, we use the corrected shape functions of Celia MA, Gray WG. An improved isoparametric transformation for finite element analysis. International Journal for Numerical Methods in Engineering 1984; 20:1447–1459, extending their applicability to the nine‐node element for plane elasticity and the 3 × 3 integration. Originally, they are tested for an eight‐node element for the heat conduction equation and the 4 × 4 integration. The improved element, designated as MITC9i, is based on the Green strain and derived from the potential energy for the plane stress condition. It is subjected to a range of tests, to confirm that it passes the patch test for several types of mesh distortions, to prove its coarse mesh accuracy and the absence of locking as well as to establish its sensitivity to mesh distortions. The improved element MITC9i performs substantially better than the MITC9 element, QUAD9** element, and our previous 9‐AS element.Copyright © 2012 John Wiley & Sons, Ltd.
ISSN:0029-5981
1097-0207
DOI:10.1002/nme.4399