Conductive coatings with low carbon-black content by adding carbon nanofibers
Conductive coatings based on low carbon-black content by adding carbon nanofibers are obtained in a silica matrix obtained by the sol–gel process. The carbon nanofibers incorporation allows reducing the percolation threshold down to 20wt.% of carbon black into the silica matrix obtaining good electr...
Gespeichert in:
Veröffentlicht in: | Composites science and technology 2014-03, Vol.93, p.9-16 |
---|---|
Hauptverfasser: | , , , |
Format: | Artikel |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | Conductive coatings based on low carbon-black content by adding carbon nanofibers are obtained in a silica matrix obtained by the sol–gel process. The carbon nanofibers incorporation allows reducing the percolation threshold down to 20wt.% of carbon black into the silica matrix obtaining good electrical properties. Coatings are deposited by air-spray deposition onto tile substrates and sintered in the temperature range of 300–500°C in air atmosphere. The coatings achieve resistivities as low as 2×10−3Ωm due to the percolation between the carbon black nanoparticles and carbon nanofibers which improves the conductive paths. The samples are microstructural characterized by Scanning Electron Microscopy and Confocal Raman Spectroscopy. The electrical properties are measured by impedance spectroscopy. The thermal properties derived of the Joule effect are measured using DC intensity–voltage curves and thermal infrared camera, and it is observed a nearly linear relationship between electric power and temperature increasing in the measured range. Thereby, a wide range of application is opened by means of tailoring the electrical response of the coatings: higher resistivity coatings produce thermal heating above 90°C, appropriated for electric heaters, and conductive coatings are suitable for electronic devices, electrodes and EMI/RFI shielding. |
---|---|
ISSN: | 0266-3538 1879-1050 |
DOI: | 10.1016/j.compscitech.2013.12.021 |