Characterization of the isothermal solidification process in the Ni/Au–Ge layer system

Characterization of the isothermal solidification process in the Ni/Au–Ge layer system

The eutectic Au28Ge (at.%) solder alloy in combination with Ni substrates or Ni coatings is interesting for applications in transient liquid phase (TLP) bonding. To achieve sound joints with high re-melting temperatures, it is necessary to gain profound knowledge about the joining process. In this w...

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Veröffentlicht in:Journal of materials science 2015-05, Vol.50 (10), p.3835-3844
Hauptverfasser: Weyrich, Nico, Leinenbach, Christian
Format: Artikel
Sprache:eng
Schlagworte:
Annealing
Bonded joints
Bonding
Characterization and Evaluation of Materials
Chemistry and Materials Science
Classical Mechanics
Crystallography and Scattering Methods
Estimates
Eutectic alloys
Liquid phases
Liquidus
Materials Science
Nickel
Nickel coatings
Original Paper
Polymer Sciences
Solders
Solid Mechanics
Solidification
Substrates
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Beschreibung
Zusammenfassung:The eutectic Au28Ge (at.%) solder alloy in combination with Ni substrates or Ni coatings is interesting for applications in transient liquid phase (TLP) bonding. To achieve sound joints with high re-melting temperatures, it is necessary to gain profound knowledge about the joining process. In this work, the isothermal solidification behavior in the Ni–Au28Ge (at.%) system was analyzed by means of microstructure evolution and time to complete solidification. In short-time annealing experiments the early stage of the reaction (
ISSN:0022-2461
1573-4803
DOI:10.1007/s10853-015-8952-x