Methods of simulating thin film deposition using spray pyrolysis techniques

[Display omitted] •A simulator for spray pyrolysis deposition is created in the Level Set framework.•Droplet atomization, transport, and silicon interaction is analyzed and modeled.•Stokes force, gravity, electrical force, and thermophoretic forces calculated.•Electric (physical transport) and air pressure (CVD) nozzles simulated differently.•3D simulation examples for electric and air pressure spray deposition performed. Integration of thin tin oxide film formation into CMOS technology is a fundamental step to realize sensitive smart gas sensor devices. Spray pyrolysis is a deposition technique which has the potential to fulfil this requirement. A model for spray pyrolysis deposition is developed and implemented within a Level Set framework. Two models for the topography modification due to spray pyrolysis deposition are presented, with an electric and a pressure atomizing nozzle. The resulting film growth is modeled as a layer by layer deposition of the individual droplets which reach the wafer surface or as a CVD-like process, depending on whether the droplets form a vapor near the interface or if they deposit a film only after surface collision.