Microstructural evolution of copper–titanium alloy during in-situ formation of TiB2 particles

Bulk Cu–Ti alloy reinforced by TiB2 nano particles was prepared using in-situ reaction between Cu–3.4%Ti and Cu–0.7%B master alloys along with rapid solidification and subsequent heat treatment for 1–10 h at 900 °C. High-resolution transmission electron microscopy (HRTEM) characterization showed that primary TiB2 nano particles and TiB whiskers were formed by in-situ reaction between Ti and B in the liquid copper. The formation of TiB whiskers within the melt led to coarsening of TiB2 particles. Primary TiB2 particles were dispersed along the grain boundaries and hindered grain growth at high temperature, while the secondary TiB2 particles were formed during heat treatment of the alloy by diffusion reaction of solute titanium and boron inside the grains. Electrical conductivity and hardness of the composite were evaluated during heat treatment. The results indicated that the formation of secondary TiB2 particles in the matrix caused a delay in hardness reduction at high temperature. The electrical conductivity and hardness increased up to 8 h of heat treatment and reached 33.5% IACS and HV 158, respectively.