A study of the stabilization of vertical alignment for liquid crystals by increasing the side-chain rigidity of polyimides

A series of polyimides (PIs) with various side‐chain structures were prepared via copolymerization of pyromellitic dianhydride, 3,3′‐dimethyl‐4,4′‐methylenediamine and three functional diamines: 4‐(4‐octyloxybenzoyloxy)biphenyl‐3′,5′‐diaminobenzoate (C8‐BPDA), 4‐octyloxybiphenyl‐3′,5′‐diaminobenzoate (C8‐PDA) and 4‐(4‐butoxybenzoyloxy)biphenyl‐3′,5′‐diaminobenzoate (C4‐BPDA). PIs derived from C8‐BPDA and C4‐BPDA exhibited excellent rubbing resistance in comparison with PI from C8‐PDA and the pretilt angle could be controlled over 89° after rubbing. Thermogravimetric analysis showed that the thermal degradation of PIs under nitrogen atmosphere occurred above 320 °C, and PI derived from C8‐BPDA showed the best thermal stability. Wide‐angle X‐ray diffraction patterns indicated an amorphous morphology of the PIs, and the PIs also had outstanding solubility in polar aprotic solvents. The resultant PI films were light colored and maintained high transparency in the visible light region. By increasing the rigidity of side‐chains, the rubbing resistance and the thermal stability of PIs could be promoted at the same time. © 2012 Society of Chemical Industry Polyimides (PIs) begin to degrade at 320 °C, and maintain more than 40% of their original weight. PI1 shows the best thermal resistance.