Wire-to-wire bonding of μm-diameter aluminum wires for the Electric Solar Wind Sail
We present a novel ultrasonic wire-to-wire bonding method for bonding two micrometer-thick metal wires together. A special jig and an industrial wire bonder perform the bonding. This wire-to-wire bonding is the core unit process to produce space tether for the Electric Solar Wind Sail. The proposed...
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Veröffentlicht in: | Microelectronic engineering 2011-11, Vol.88 (11), p.3267-3269 |
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Hauptverfasser: | , , , , |
Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | We present a novel ultrasonic wire-to-wire bonding method for bonding two micrometer-thick metal wires together. A special jig and an industrial wire bonder perform the bonding. This wire-to-wire bonding is the core unit process to produce space tether for the Electric Solar Wind Sail. The proposed method was validated experimentally with 38 bonds where a 25
μm and a 50
μm by diameter Al wires that were first bonded together after which the bond was pull tested. The measured average pull force was (74
±
15)
mN whereas the lowest pull force value was 40
mN. The results show that wire-to-wire bonds of sufficient strength can be produced for the Electric Solar Wind Sail tether application. Tether manufacturing was demonstrated with a separate test where a 1.4
m long tether was produced featuring more than 100 wire-to-wire bonds. |
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ISSN: | 0167-9317 1873-5568 |
DOI: | 10.1016/j.mee.2011.07.002 |