UV nanoimprint lithography of sub-100 nm nanostructures using a novel UV curable epoxy siloxane polymer
We reported the replication of sub-100 nm nanostructures by an ultraviolet (UV) nanoimprint lithography (NIL) technique. We used a novel UV curable epoxy siloxane polymer as the NIL resist to achieve features as small as 50 nm. The polymeric soft molds for the NIL were fabricated by casting toluene...
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Veröffentlicht in: | Microelectronic engineering 2010-11, Vol.87 (11), p.2411-2415 |
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Hauptverfasser: | , , , , , , |
Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | We reported the replication of sub-100
nm nanostructures by an ultraviolet (UV) nanoimprint lithography (NIL) technique. We used a novel UV curable epoxy siloxane polymer as the NIL resist to achieve features as small as 50
nm. The polymeric soft molds for the NIL were fabricated by casting toluene diluted poly(dimethyl-siloxane) (PDMS) on the hydrogensilsesquioxane (HSQ) hard mold. The NIL results were characterized by using a scanning electron microscope and an atomic force microscope. Our results illustrate that, with the epoxy siloxane resist, the 50
nm HSQ features on the hard mold can be successfully replicated using PDMS soft molds. |
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ISSN: | 0167-9317 1873-5568 |
DOI: | 10.1016/j.mee.2010.04.016 |