Study of surface morphology and refractive index of dielectric and metallic films used for the fabrication of monolithically integrated surface plasmon resonance biosensing devices

[Display omitted] ► We have investigated fabrication of monolithically integrated SPR biosensing devices. ► PECVD offers SiO2 films of superior optical properties. ► The Au films by e-beam at deposition rates not exceeding 0.3nm/s are desirable. ► Deposition at 0.5nm/s allows avoiding the excessive...

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Veröffentlicht in:Microelectronic engineering 2012-05, Vol.93, p.91-94
Hauptverfasser: Jimenez, Alvaro, Lepage, Dominic, Beauvais, Jacques, Dubowski, Jan J.
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Sprache:eng
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Zusammenfassung:[Display omitted] ► We have investigated fabrication of monolithically integrated SPR biosensing devices. ► PECVD offers SiO2 films of superior optical properties. ► The Au films by e-beam at deposition rates not exceeding 0.3nm/s are desirable. ► Deposition at 0.5nm/s allows avoiding the excessive heating of photoresists. Integration in a single chip using localized optical phenomena is one of the possible approaches to attain the accuracy, portability and affordability required for future biosensing devices. We address this problem by investigating a grating-coupled quantum well (QW) surface plasmon resonance (SPR) device that comprises a monolithically integrated source of light and a bio-sensitive surface. The successful operation of such a device requires, in addition to the optimization of its architecture, the use of high quality thin films with smooth surface morphology. Here, we present the results of studying a variety of dielectric and Au films intended for the fabrication of QW-SPR devices. For dielectrics, we found that SiO2 films obtained by plasma-enhanced chemical vapor deposition have the best surface morphology and optical properties appropriate for our device. The films of Au fabricated with deposition rates exceeding 0.3nm/s exhibited relatively smooth surface morphology, however the presence of surface micro-inclusions reduced the attractiveness of such films. To avoid sample overheating that occurs at extremely slow deposition rates, we optimized the fabrication of Au films at 0.05 and 0.2nm/s.
ISSN:0167-9317
1873-5568
DOI:10.1016/j.mee.2011.10.016