KrF excimer laser dry and steam cleaning of silicon surfaces with metallic particulate contaminants

KrF excimer laser dry and steam cleaning of silicon surfaces with metallic particulate contaminants

KrF excimer laser-assisted dry and steam cleaning of single-crystal silicon wafers contaminated with three different types of metallic particles was studied. The laser fluence used was 0.3 J/cm. In the dry process, for samples cleaned with 100 laser pulses the cleaning efficiency was 91, 71 and 59%...

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Veröffentlicht in:Applied physics. A, Materials science & processing Materials science & processing, 2002-02, Vol.74 (2), p.191-199
Hauptverfasser: NEVES, P, ARRONTE, M, VILAR, R, BOTELHO DO REGO, A. M
Format: Artikel
Sprache:eng
Schlagworte:
Clean metal, semiconductor, and insulator surfaces
Cleaning
Condensed matter: electronic structure, electrical, magnetic, and optical properties
Condensed matter: structure, mechanical and thermal properties
Contaminants
Contamination
Cross-disciplinary physics: materials science
rheology
Drying
Electron and ion emission by liquids and solids
impact phenomena
Exact sciences and technology
Excimer lasers
Lasers
Materials science
Metal particles
Photoemission and photoelectron spectra
Physical radiation effects, radiation damage
Physics
Silicon
Structure of solids and liquids
crystallography
Surface cleaning, etching, patterning
Surface treatments
Ultraviolet, visible, and infrared radiation effects (including laser radiation)
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Zusammenfassung:KrF excimer laser-assisted dry and steam cleaning of single-crystal silicon wafers contaminated with three different types of metallic particles was studied. The laser fluence used was 0.3 J/cm. In the dry process, for samples cleaned with 100 laser pulses the cleaning efficiency was 91, 71 and 59% for Au, Cu and W particles, respectively, whilst in steam cleaning the efficiency is about 100% after 5 laser pulses, independently of the type of contaminant.
ISSN:0947-8396
1432-0630
DOI:10.1007/s003390100868