Influence on Cooling Performance of Jet Impingement Heat Sink Structures

We studied a jet impingement heat sink for cooling modular power semiconductor devices. The purpose of the study was to investigate the influences on cooling performance of simplified structures of the heat sinks that suppresses the jet velocity to avoid pitting corrosion or erosion of the impingeme...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:IEEE transactions on components, packaging, and manufacturing technology (2011) packaging, and manufacturing technology (2011), 2013-05, Vol.3 (5), p.818-825
Hauptverfasser: Nakahama, Takafumi, Tai, Hirimochi
Format: Artikel
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:We studied a jet impingement heat sink for cooling modular power semiconductor devices. The purpose of the study was to investigate the influences on cooling performance of simplified structures of the heat sinks that suppresses the jet velocity to avoid pitting corrosion or erosion of the impingement wall. The influence on the cooling performance of partition plates used to prevent mutual interference between jets from circular nozzles was verified. We confirmed the influence on the cooling performance of the wall shape of the header and the influence of the distance from the nozzle to the wall (jet height) in the case of small ratio of the jet height to the nozzle diameter. We verified the influence on the cooling performance of the relation between the directions of the array of multiple jets and the direction of the exhaust flow. Flow visualization was performed using a mock-up model of a jet impingement heat sink. From the visualization, we found the reason on the influence of the relation between those directions. As a result, we found that the structure of the heat sink was able to be simplified maintaining the cooling performance of the conventional heat sink.
ISSN:2156-3950
2156-3985
DOI:10.1109/TCPMT.2013.2252712