High-Density Solder Bump Interconnect for MEMS Hybrid Integration

High-Density Solder Bump Interconnect for MEMS Hybrid Integration

An ultra high-density hybrid integration for micro-electromechanical system (MEMS) mirror chips with several thousand inputs/outputs has been developed. The integration scheme involving flip-chip assembly provides electrical signal to individual mirrors, which is compatible with postprocessing steps...

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Veröffentlicht in:IEEE transactions on advanced packaging 2007-11, Vol.30 (4), p.622-628
Hauptverfasser: Basavanhally, N., Lopez, D., Aksyuk, V., Ramsey, D., Bower, E., Cirelli, R., Ferry, E., Frahm, R., Gates, J., Klemens, F., Lai, W., Low Yee, Mansfield, W., Chien-Shing Pai, Papazian, R., Pardo, F., Sorsch, T., Watson, P.
Format: Artikel
Sprache:eng
Schlagworte:
Application specific integrated circuits
Arrays
Assembly
Assembly systems
Bonding
Compatibility
Deposition
Electrodes
Flip-chip
hybrid assembly
Microelectromechanical systems
microelectromechanical systems (MEMS) integration
Micromechanical devices
mirror array
mirror release
Mirrors
Optical modulation
Packaging
Releasing
Silicon on insulator technology
solder bumps
Solders
spatial light modulator (SLM)
Wet etching
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Beschreibung
Zusammenfassung:An ultra high-density hybrid integration for micro-electromechanical system (MEMS) mirror chips with several thousand inputs/outputs has been developed. The integration scheme involving flip-chip assembly provides electrical signal to individual mirrors, which is compatible with postprocessing steps of selectively removing the silicon handle and releasing the MEMS mirrors. For the first time, to our knowledge, solder deposition and flip-chip bonding of 3-mum bumps on 5-mum centers of a large array has been demonstrated.
ISSN:1521-3323
1557-9980
DOI:10.1109/TADVP.2007.906395