Copper effects in mechanical properties of rapidly solidified Sn–Pb–Sb Babbitt bearing alloys
► The intermetallic compound Cu 6Sn 5 is formed by the addition of 5 wt% copper. ► The elastic modulus and hardness increase by addition of 5 wt% copper. ► The stress exponent indicates that grain boundary sliding is the possible mechanism. ► The alloy Sn–25%Pb–10%Sb–5%Cu has good mechanical propert...
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Veröffentlicht in: | Materials science & engineering. A, Structural materials : properties, microstructure and processing Structural materials : properties, microstructure and processing, 2011-12, Vol.530, p.327-332 |
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Hauptverfasser: | , , , |
Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | ► The intermetallic compound Cu
6Sn
5 is formed by the addition of 5
wt% copper. ► The elastic modulus and hardness increase by addition of 5
wt% copper. ► The stress exponent indicates that grain boundary sliding is the possible mechanism. ► The alloy Sn–25%Pb–10%Sb–5%Cu has good mechanical properties than Sn–30%Pb–10%Sb.
The mechanical behavior of Sn–Pb–Sb Babbitt bearing alloys has been modified with 5
wt% copper and processed by melt spinning technique. Results on the rapid solidification structure and the ribbon indentation creep tests are discussed. The stress exponent values in the range 2.11–2.75 indicate that grain boundary sliding is the possible mechanism during room-temperature creep deformation of melt-spun bearing alloys. |
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ISSN: | 0921-5093 1873-4936 |
DOI: | 10.1016/j.msea.2011.09.092 |