Optoelectronic multichip module integration for chip level optical interconnects

Optoelectronic multichip module integration for chip level optical interconnects

We have integrated an 850-nm vertical-cavity surface-emitting laser (VCSEL), its driver, and a diffractive lenslet array onto a single substrate to produce an integrated optoelectronic multichip module for signal fan-out and distribution. The diffractive element performs optical fan-out of the outpu...

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Veröffentlicht in:IEEE photonics technology letters 2001-10, Vol.13 (10), p.1112-1114
Hauptverfasser: Prather, D.W., Venkataraman, S., Lecompte, M., Kiamilev, F., Mait, J.N., Simonis, G.J.
Format: Artikel
Sprache:eng
Schlagworte:
Arrays
Beams (radiation)
Diffraction
Drivers
Integrated optics
Integrated optoelectronics
Laser beams
Lenses
Multichip modules
Optical arrays
Optical device fabrication
Optical diffraction
Optoelectronics
Surface emitting lasers
Systems design
Vertical cavity surface emission lasers
Vertical cavity surface emitting lasers
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Beschreibung
Zusammenfassung:We have integrated an 850-nm vertical-cavity surface-emitting laser (VCSEL), its driver, and a diffractive lenslet array onto a single substrate to produce an integrated optoelectronic multichip module for signal fan-out and distribution. The diffractive element performs optical fan-out of the output beam from the VCSEL into an array of focused spots at a plane 1, 416 μm from the surface of the VCSEL. This corresponds to 160 μm from the surface of the diffractive lens. System design, fabrication, integration, and experimental characterization is presented.
ISSN:1041-1135
1941-0174
DOI:10.1109/68.950752