Packaging Method for Increased Isolation Using a Microstrip to Waveguide Transition

A new technique to decrease crosstalk within high frequency packages, which is based on a microstrip to waveguide transition, is presented. The waveguide based packaged circuit demonstrates well over 40% bandwidth and the insertion loss throughout the designed frequency band is comparable to that of...

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Veröffentlicht in:	IEEE microwave and wireless components letters 2007-03, Vol.17 (3), p.163-165
Hauptverfasser:	Schulwitz, L., Ortiz, S., Mortazawi, A.
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Bandwidth Circuit properties Circuit testing Circuits Crosstalk Design. Technologies. Operation analysis. Testing Electric, optical and optoelectronic circuits Electromagnetic compatibility electromagnetic interference (EMI) Electronics Exact sciences and technology Filters Frequency Frequency bands High frequencies Information, signal and communications theory Insertion loss Integrated circuits interconnect Interference suppression Low frequencies Microstrip Microwave circuits, microwave integrated circuits, microwave transmission lines, submillimeter wave circuits Microwaves Packages Packaging Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Telecommunications and information theory Testing, measurement, noise and reliability waveguide transition Waveguide transitions Waveguides
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