Packaging Method for Increased Isolation Using a Microstrip to Waveguide Transition

A new technique to decrease crosstalk within high frequency packages, which is based on a microstrip to waveguide transition, is presented. The waveguide based packaged circuit demonstrates well over 40% bandwidth and the insertion loss throughout the designed frequency band is comparable to that of the conventional packaging approaches. In contrast to the conventional implementations, this new packaging method achieves approximately 20-dB isolation improvement for a test circuit as presented here. In addition, to suppress low frequency interference, a dc and low frequency filter is implemented as part of the waveguide transition