One-step sculpting of silicon microstructures from pillars to needles for water and oil repelling surfaces

Surfaces that repel both water and oil effectively (contact angles > 150°) are rare. Here we detail the microfabrication method of silicon surfaces with such properties. The method is based on careful tuning of the process conditions in a reactive etching protocol. We investigate the influence of SF6, O2 and CHF3 gases during the etching process using the same pitch of a photolithographic mask. Varying the loading conditions during etching, we optimized the conditions to fabricate homogeneous pedestal-like structures. The roughness of the microstructures could also effectively be controlled by tuning the dry plasma etching conditions. The wetting behavior of the resulting microstructures was evaluated in terms of the water and oil contact angles. Excitingly, the surfaces can be engineered from superhydrophobic to omniphobic by variation of the aforementioned predefined parameters.